Foundry Services
- Front-End Wafer Processing
- Back-End Assembly Line
- Engineering Support
- Dual Source US & UK
Intense is a world leading manufacturer of III-V Optoelectronic devices, utilizing a wide range of material systems, including AlGaAs, AlGaInP, InGaAsP and GaN.
Intense has an enviable track record delivering Front and Back-end services to many international organizations, fab-less as well as vertically integrated. Our high quality services include a fully staffed foundry and a team of exceptionally skilled and experienced engineers. Utilizing these services enables Intense's customers to bring innovative products to market faster. Additionally, "outsourcing" enables the development of competitively priced products by removing the need for capital investment and the associated overhead. Get the best for your enterprise:
- High-End Processing Equipment in the US and UK
- Skilled Operations and Engineering Team
- Product Development Support Services
- Access to Quantum Well Intermixing (QWI)
- Fast and Flexible Process Execution
- ISO 9001: 2008 certified quality management
Front-End Processing
Intense uniquely offers a full range of Front-end process equipment plus related pre-qualified processes, enabling our customers to compete in today's optoelectronics market. Our scalable 3" production line incorporates:
- ICP and RIE dry etching as well as wet etching processes of various semiconductor materials, metals and ceramics
- Photolithography using contact alignment and highly accurate stepper technology
- Deposition using sputtering, PECVD and evaporation
- Mechanical thinning, polishing, scribing and automated pick and place
- Metrology using i.e. ellipsometer, Dektak, PL mapper, spectrophotometer, microscopes and SEM
- The facility is ISO Class 4 (FS Class 10) with a clean room of more than 3500 sq ft
Back-End Manufacturing
In addition to our III-V foundry, Intense offers a wide range of packaging services to our customers:
- Comprehensive assembly of complex OEM systems, including customized driver electronics and optics design.
- Packaging of bars and related subsystems
- Single bar mounts, bar arrays and stacks
- Rod pump units
- FAC design and lens attachment
- High volume automated packaging of optoelectronic commodity products:
- TO-Can (5.6, 9mm, TO3)
- Modules with and without fiber attach
Benefits
- No capital investment required
- Competitive variable costs
- High quality, lean manufacturing
- Fast and flexible product development "on demand"
- Risk reduction by outsourcing with controllable product cost
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